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DayOne Data Centers in Talks for $500 Million Bond Amid AI Infrastructure Demand

Oct 9, 2026
AI Summary

DayOne Data Centers Ltd. is exploring a $500 million bond offering as it seeks to raise funds to meet increasing demand for AI infrastructure. The discussions are ongoing despite a setback from a partner, Firmus Grid Ltd., which recently abandoned its IPO plans.

  • DayOne Data Centers Ltd. is engaged in preliminary discussions with banks regarding a potential $500 million bond offering.
  • The company is based in Singapore and aims to raise funds to support growing demand for artificial intelligence infrastructure.
  • The talks will continue despite the recent decision by Firmus Grid Ltd., a partner backed by Nvidia Corp., to withdraw its initial public offering plans in Australia.
fundraisingartificial intelligenceinfrastructurebond offeringdayone data centers